Traditional BGA rework equipment often relies on a single heating method: pure hot air heating can easily cause heat diffusion and damage surrounding microcomponents, while pure laser solutions struggle with larger chips or boards requiring overall preheating. In actual rework, PCB assemblies are becoming increasingly complex, with dense chip layouts and an increasing number of heat-sensitive components. Accurate, safe, and efficient rework has become a common challenge in the industry.

Triple heating, collaborative operation

Seamark LA600 innovatively integrates three technologies: upper hot air, lower infrared heating bricks, and laser local heating:

The lower infrared + hot air combined preheating uses a large 335mm×260mm infrared heating brick and hot air from upper and lower independent temperature zones to evenly preheat the PCB and chips.

Laser precise micro-area temperature control. Compared with traditional heating methods, the laser heat action range is highly controllable, effectively avoiding the risk of heat diffusion, significantly reducing the probability of thermal damage to peripheral and back components, and greatly improving the accuracy and efficiency of BGA rework.

Fully automatic integrated process

The equipment integrates four core functions: automated disassembly, detinning, mounting, and soldering, forming a complete closed-loop process. After visual alignment, the equipment automatically completes the entire process, from non-destructive disassembly, efficient pad tin removal and slag recovery, to precise mounting and reliable soldering. This significantly reduces manual intervention, improves operational efficiency and consistency, and truly achieves precision rework automation.

High-precision parameter configuration

The device is equipped with a 5-megapixel vision system with an alignment accuracy of up to ±0.025mm; 8-channel temperature measurement interface + K-type thermocouple closed-loop control, with a temperature control accuracy of ±1°C; supports two path generation methods: Gerber file import and file-free puzzle generation; and is applicable to a wide range of chips (2x2mm~50x50mm), covering most precision chip rework scenarios.

One machine for multiple uses, reducing costs and increasing efficiency

The Seamark LA600 integrates multiple rework process capabilities into a single device, eliminating the need to purchase multiple devices for different products. This not only saves costs but also reduces process switching and operational complexity. Whether it's microchip laser rework or conventional BGA hot air desoldering, precise control is achieved.

Consult Seamark now to get exclusive customized solutions for your products!